The domestic production rate of front-end semiconductor inspection equipment has risen to 31%, breaking through key technological bottlenecks.
Sep 30,2025
China's progress in domesticating front-end semiconductor inspection equipment is accelerating, with the localization rate rising from 19% in 2023 to 31% by 2025. Several "bottleneck" technologies have also achieved breakthroughs. In the field of wafer defect detection, domestically produced equipment can now identify defects as small as 10 nanometers—matching the level of mainstream international solutions.
The technological breakthrough has been made possible by sustained increases in R&D investment, with industry R&D spending now accounting for 18% of revenue. Key advancements include mastering core components such as high-resolution optical systems and high-speed data-processing chips. Currently, domestically produced equipment has already been integrated into multiple 12-inch wafer production lines, enabling mass supply. Moreover, the detection efficiency of these domestically developed systems rivals that of their foreign counterparts, while offering a price advantage of 20% to 30%.
Industry insiders say that with the comprehensive optimization of patent strategies—China accounted for 41% of global patent applications for testing equipment in 2024—the domestic production rate is expected to surpass 50% within the next three years, further ensuring the autonomy and controllability of the industrial chain.
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